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Main / Products / Foamed polystyrene boards / LEPSZY – boards with increased thermal insulation properties / Foamed polystyrene boards LEPSZY 0,031
Foamed polystyrene boards LEPSZY 0,031
Thermal insulation subject to low mechanic loads:  
  • thermal insulation of walls and ceilings from the bottom in Jointless Warming Systems [BSO], i.e. insulation performed in a light-wet method
  • insulation of walls with cladding, ventilated by air slots 
  • thermal crown insulation made under the plaster an as insulation of lintels and door frames
  • insulation in prefabricated multilayer boards
  • insulation of ceilings made of reinforced concrete as lost planking
  • insulation of steep roofs laid under the bearing structure
     

technical data – PDF

declaration of compliance – PDF (only in polish available)
 

Why is it worth using LEPSZY boards?

  IDEAL REAPITIBILITY OF BOARDS

That what makes LEPSZY unique is modern automated fabrication technology. What does it mean? LEPSZY boards are formed in the mould, which makes them identical at each production cycle. The repeatability assures that two foamed polystyrene boards from two different production cycles fit perfectly. In other words, the two boards match perfectly regardless of the fabrication period, purchase series and delivery date.

Automated technology also means higher density of pellets. This translates to increased resistance to separation of particles at the surface of the board. That eliminates dusting therefore, increases adhesion. Finally higher density of pellets reduces the use of other construction materials in case of necessary repair of broken boards.
PERMANENTLY PLOTTED GAUGE AND MARKED WALL ATTACHMENT PLACES

To assure full comfort of installation boards are equipped with a gauge on their surface with a precision of 1 cm. This makes it easy to cut the board to the required dimensions without the need of use additional measuring tools.

The side of board with gauge is the building side. Dense network of grooves at this side increases the adhesiveness of subsequent layers of thermal insulation.

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